Hot melts · F-GL-077 · IV-4.8

Metallocene PO hot melt packaging

A next-generation hot melt based on metallocene polyolefin resin with C5 tackifier, paraffin wax and antioxidants, delivering superior adhesion to low-energy substrates and higher heat resistance than conventional EVA.

Key ingredients: C5 hydrocarbon resin (SP 100 °C), Paraffin wax (mp 62 °C), Antioxidant AO-1010, BHT

Percentages, alerts, QC plan and the printable report open after you unlock this formula.